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Our Interconnect Round Ribbon is engineered to deliver superior electrical performance, reliability, and efficiency in modern photovoltaic module manufacturing. Designed and manufactured with precision, it ensures optimal current flow, reduced resistance, and excellent solderability—making it the ideal choice for high-quality solar panel interconnections. With consistent dimensional accuracy, robust mechanical strength, and enhanced durability, our round ribbon supports improved module output and long-term stability. Backed by advanced production technology and stringent quality control, it provides customers with a dependable solution tailored for next-generation PV applications.
| Interconnect Ribbon (ROUND) | ||||
|---|---|---|---|---|
| Width | 0.2mm to 0.5 mm | |||
| Thickness Tolerance | 0.2mm to 0.5 mm | |||
| Standard coating | As Per Customer Requirement | |||
| Leaded Coating | 60 SN/40PB 625N/36PB/2Ag |
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| Leaded Free Coating | 100 Sn Sn96.5/Ag 3.5 Sn95.5/Ag4.0/Cu0.5 |
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| Camber | ≤ 3mm/1000 mm | |||
| Softness | Tensile strength | Yield strength | Elongation | |
| Flexiable | 150 Ν/ΜΜ2 Το 200 N/MM2 | ≤70 | ≥25% | |
| Super Flexiable | ≤60 | ≥30% | ||
| Extrem Flexiable | ≤55 | ≥35% | ||
| TOLERANCE | ||
| Testing Name | Interconnect Ribbon (Round) | |
| Width | ±0.1 mm | |
| Thickness | ±0.05 mm | |
| Coating Thickness | ≤1.707 x 10 mm @20 C | |
| Coating Type | Thickness of coating can vary from 0.010 mm to 0.050 mm | |
| Specifications of the solder coating | ||
| Interconnect Ribbon (Flat) | ||
| Tin Coat Thickness | 230µm(** other thickness is Available on request) | |
| Tin Coat thickness error | ± 0.005 mm | |
| Type of Coating& Composition | Curing temperature(*C) | |
| Leaded (Non RoHs)-60sn40pb | 183°C | |
| Leaded (Non RoHS)-625n36pb2Ag | 179°C | |
| RoHS Complianced Lead Free-96.55n3.5Ag/Sn100/SnAgCu | 221°C | |
Advantages
- Reduced Optical Shading
- Light Reflection Benefit
- Lower Series Resistance
- Improved Module Efficiency
- Reduced Micro-Cracks
- Thermal Stability
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